h thin-film cascadable amplifier 20 to 1000 mhz t echnical data features ? frequency range: 20 to 1000mhz ? high dynamic range ? low noise figure: 2.5 db (typ) ? medium power output: +13.0 dbm (typ) ? temperature compensated ? surface mount option applications ? wideband rf system front end description the 1044 series is a high power thin-film bipolar rf amplifier using lossless feedback for low noise, high dynamic range and efficient operation; and active bias circuits to assure good tempera- ture compensation and increased immunity to bias voltage varia- tions. the 1044 series amplifiers are available in three packages: the surface mount planarpak pp-38 (.375 in. x .375 in.) case, the to-8 hermetic case and the connectorized tc-1 case. a vantek products uto/utc/ppa 1044 series pin configuration utoto-8t ground case ground v + rf out rf in utctc-1 rf v + in rf out ppapp-38 v + ground rf in rf out schematic maximum ratings parameter maximum dc voltage +17 volts continuous rf input power +13 dbm operating case temperature C55 to +125 c storage temperature C62 to +150 c r series burn-in temperature +125 c rf out rf in v+ thermal characteristics 1 q jc 105 c/w active transistor power dissipation 256 mw junction temperature above case temperature 27 c mtbf (mil-hdbk-217e, a uf @ 90 c) 955,100 hrs. note 1: for further information, see reliability screening, pub. 5963-3240e. weight: (typical) pp a 0.5 grams; ut o 2.1 grams; ut c 21.5 grams
2 electrical specifications 1 (measured in 50 w system @ +15 vdc nominal unless otherwise noted) symbol unit t c = C55 to +85 c 20-1000 9.0 1.0 5.0 +11.0 2.0:1 2.0:1 +21.0 mhz db db db dbm dbm dbm dbm ma t c = 0 to 50 c guaranteed specifications typical t c = 25 c 20-1000 11.0 0.5 2.5 +13.0 <1.8:1 <1.8:1 +25.0 +35.0 +46.0 35 20-1000 10.0 1.0 4.5 +12.0 2.0:1 2.0:1 +22.0 characteristic frequency range small signal gain (min.) gain flatness (max.) noise figure (max.) power output @ +1 db comp. (min.) 2 input vswr (max.) output vswr (max.) two tone 3rd order intercept point two tone 2nd order intercept point one tone 2nd harmonic intercept point dc current bw gp nf p 1db ip 3 ip 2 hp 2 i d notes: 1. both rf input and rf output pins are at dc ground no blocking capacitor/PPA-1044 = preliminary. 2. PPA-1044, power output = 12 dbm (typ) @ 25 c, 11.5 dbm from 0 to 50 c and 11.0 dbm from C55 to +85 c. typical performance over temperature (@ +15 vdc unless otherwise noted) key: +25 c +85 c -55 c 12 gain, db 0 gain frequency, mhz 200 11 400 800 1000 10 600 noise figure, db frequency, mhz noise figure 5 4 3 2 9 20 200 400 800 1000 600 1200 +12 vdc & +15 vdc 14 power output
@ 1 db gain
compression, dbm power output frequency, mhz 20 vswr input vswr frequency, mhz vswr output vswr frequency, mhz 200 2.0 1.75 1.5 1.25 1.0 600 12 400 800 1000 2.0 1.0 1.75 1.5 1.25 13 29 ip 3 , dbm third-order intercept point frequency, mhz 20 second-order intercept point frequency, mhz second-harmonic intercept point frequency, mhz 200 60 55 50 20 200 400 600 26 1000 400 800 600 800 27 1000 50 40 28 ip 2 , dbm hp 2 , dbm 11 45 55 45 0 200 600 400 800 1000 0 200 600 400 800 1000 20 200 600 400 800 1000 1200 +12 vdc 35
3 automatic network analyzer measurements frequency vswr gain phase phase group delay vswr isolation mhz in db degrees dev ns out db numerical readings bias = 15.00 volts 100.0 1.13 11.12 168.56 C2.87 .00 1.17 16.40 200.0 1.20 11.02 152.79 C2.76 .43 1.28 16.39 300.0 1.27 11.01 137.45 C1.73 .41 1.41 16.56 400.0 1.31 11.04 123.61 C.21 .39 1.49 16.64 500.0 1.30 11.12 109.58 1.63 .39 1.54 16.66 600.0 1.24 11.19 95.25 3.19 .41 1.52 16.52 700.0 1.18 11.21 80.12 3.78 .43 1.45 16.47 800.0 1.02 11.24 63.73 3.42 .47 1.35 16.44 900.0 1.23 11.04 46.58 2.14 .50 1.30 16.33 1000.0 1.51 10.69 28.83 .28 .52 1.40 16.44 (typical production unit @ +25 c ambient) s-parameters s 21 100.00 .063 154.8 11.090 167.6 C16.592 169.3 .077 141.1 150.00 .075 120.6 11.053 159.7 C16.417 161.1 .096 114.7 200.00 .089 101.4 10.958 151.8 C16.537 152.8 .124 100.4 250.00 .108 85.3 10.930 143.9 C16.541 146.0 .145 88.3 300.00 .123 75.5 10.946 136.4 C16.639 139.5 .164 79.6 350.00 .130 65.9 10.980 129.0 C16.626 132.6 .182 71.7 400.00 .134 56.4 11.016 121.7 C16.607 126.4 .193 65.0 450.00 .132 46.7 11.073 114.7 C16.601 120.6 .201 58.7 500.00 .127 39.5 11.084 107.2 C16.583 114.3 .207 53.1 550.00 .114 32.6 11.157 100.1 C16.585 108.4 .204 48.6 600.00 .096 24.7 11.202 92.6 C16.565 102.1 .199 44.9 650.00 .075 18.2 11.221 84.7 C16.503 96.5 .189 41.8 700.00 .046 15.5 11.228 76.9 C16.470 90.3 .176 40.5 750.00 .011 28.3 11.254 68.7 C16.407 84.4 .160 41.8 800.00 .028 156.2 11.233 60.2 C16.406 77.7 .144 46.0 850.00 .072 153.9 11.183 51.5 C16.434 71.0 .135 53.9 900.00 .123 147.5 11.062 42.5 C16.370 64.7 .136 65.3 950.00 .173 140.7 10.896 33.2 C16.366 58.1 .148 75.0 1000.00 .220 133.4 10.691 24.3 C16.460 51.8 .174 82.9 1050.00 .269 123.8 10.378 14.5 C16.543 45.4 .212 85.8 1100.00 .316 116.2 10.038 5.5 C16.648 38.8 .251 86.3 1200.00 .390 101.4 9.272 C11.7 C17.028 26.0 .326 82.0 1300.00 .449 87.8 8.368 C27.1 C17.369 14.3 .393 74.7 1400.00 .486 75.0 7.393 C41.8 C17.792 3.8 .445 67.0 1500.00 .511 64.0 6.429 C55.2 C18.261 C6.5 .484 60.0 bias = 15.00 volts frequency mhz mag ang db ang db ang mag ang s 11 s 22 s 12
4 product options uto ?509r screening option blank = no screening
r = r-series screening
for more information on r-series screening,
see reliability screening, pub. 5963-3240e. model number prefix uto-
utm-
ppa- model number utc ?509-1 connector option for tc-1 case the only connector option
available is the -1. the -1 option consists
of a sma female connector on both the
input and output (see note). model number prefix utc- model number note: r-series screening is not available in the tc-1 case as the case is non-hermetic. case drawings to-8t .031 .031 .50
dia .450
dia max .200 .017 .22
min +.002 - 001 .150
typ .300
typ ground case
ground v .150
typ 3 4 2 1 45 approximate weight 2.1 grams + rf in rf out glass ring
.060 dia typ
(3x) notes (unless otherwise specified): 1. dimensions are specified in inches 2. tolerances: xx .02 xxx .010
5 case drawings tc-1 gnd .350 .890 .460 .310 dc input .38
(2) pl .24 .19 sma jack (female)
(2) pl .180 .640 .905 .095 .250 .570 2-56 unc-2b x .15 deep
threaded insert
(4) pl .460 .310 .350 1.000 .820 product marking
area typical weight with connectors = 21.5 grams
rf .100 v + in rf out notes: 1. the tc-1 case is a non-hermetic case.
2. the only connector option available for the tc-1 case is the ?, sma female connectors at both input and output ports.
agc (if required) .890 .500 notes (unless otherwise specified): 1. dimensions are specified in inches 2. tolerances: xx .02 xxx .010
.375 x .375 planarpak surface mounted components case drawings pp-38 .010 r
(4) plcs. .035r
(4) plcs detail "a" "a" .040
(4) plcs .010
(4) plcs. .015 .006 .004 .150 ?.010 .010 (4) plcs .040 .015 + .002
(4) plcs .030
(3) plcs .375 sq. c l c l .050 ?.010
(8) plcs. 4 3 2 1 note 5 typical weight 0.5 grams pin designation case 1 2 3 4 pp-38 rf in ground rf out v + pp-38m rf lo if n/c pp-38f rf in ground rf out ground notes (unless otherwise specified): 1. dimensions are specified in inches 2. tolerances: xxx .005 3. leads are for testing only and may be trimmed flush at time of installation. 4. n/c = not connected 5. pin 2 is not at ground potential for pp-38m. it looks the same as pins 1, 3, and 4. recommended assembly procedure 1. chemically clean the pc board and the unit to be mounted using a vapor degreaser or acetone followed by an isopropol alcohol wash. do not use ultrasonic cleaning. 2. mask the backside of the pc board to prevent solder from reflowing through the plated thru-holes causing a rough ground plane surface. a suggested masking material is 2 mil thick kapton? film with silicone adhesive back (permacel part #p-222). 3. apply solder cream (suggest multicore sn62prmab3 or equivalent) using screen printing techniques or careful hand application. a layer 4 to 6 mils thick is adequate. 4. reflow of the unit to the board may be done in many ways. using a hot plate is one of the most simple. during reflow, pressure (with a clamping arrangement) on the unit is recommended, but not absolutely necessary. absolute maximum reflow temperature is 260 c for not more than 10 seconds. 5. chemically reclean the unit using the procedures given in step one. make sure that a flux remover is used which is appropriate for the type of solder cream used (multicore pc81 is the recommended flux remover for the above mentioned cream). it should be noted that there are many alternatives for component attachment. this procedure has been found to be simple and effective. for more detailed instructions on how to use planarpak products, please see the application note planarpak users information, pub.5963-3232e. for more information: united state s * europe* far east/australasia: (65) 290-6305 canada: (416) 206-4725 japan: (81 3) 3331-6111 * call your local hp sales office listed in your telephone directory. ask for a components representative. data subject to change copyright ? 1995 hewlett-packard co. printed in u.s.a. 5963-2514e (10/94) h
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